The PM300 probe system is the ideal solution for engineering tests of 300 mm wafers and substrates. Irrespective of the application, the versatility of the PM300 meets requirement from failure analysis (FA) to device and wafer characterization (DWC) to wafer-level reliability (WLR) testing and ensures the highest possible degree of precision. Testing flat panel displays is enabled by using the optional square chuck.
The superior mechanics of the prober are the basis for stable and precise system setup regardless of your application.The X and Y axes of the chuck stage can be moved easily and individually for fast coarse adjustment. Each axis has been designed with an individually magnetic lock and a vacuum brake that enables the fine glide chuck stage to be exactly positioned whenever you release the button. Fine adjustment is ensured for X and Y by high-precision micrometers.