A wafer is a thin slice of semiconductor material, such as a silicon crystal, used in the fabrication or prototyping of integrated circuits (ICs) and other micro devices. A wafer probing station is the simplest and most direct method of testing un-encapsulated die (a portion/chip of a wafer). Wafer probing is required if:
Specification requires that dies are 100% probed or characterised.
Select parameter testing or probing at temperature (hot/cold).
Devices with higher performance levels are to be identified and segregated accordingly.
A possible industry is envisioned in specialised device testing/characterisation (and modelling).
The "300 mm" provides the maximum size of the wafer that can be tested. Smaller wafers or diced wafers/dies can also be tested using this prober.