300 mm/12 inch Wafer Probing Station for mm-Wave applications

Model: 
Wafer Probing Station for mm-Wave applications
Manufacturer: 
300 mm/12 inch
Supplier: 
4G Technologies
300 mm/12 inch Wafer Probing Station for mm-Wave applications

A wafer is a thin slice of semiconductor material, such as a silicon crystal, used in the fabrication or prototyping of integrated circuits (ICs) and other micro devices. A wafer probing station is the simplest and most direct method of testing un-encapsulated die (a portion/chip of a wafer).
Wafer probing is required if:

  • Specification requires that dies are 100% probed or characterised.
  • Select parameter testing or probing at temperature (hot/cold).
  • Devices with higher performance levels are to be identified and segregated accordingly.
  • A possible industry is envisioned in specialised device testing/characterisation (and modelling).

The "300 mm" provides the maximum size of the wafer that can be tested. Smaller wafers or diced wafers/dies can also be tested using this prober.

Status: 
Available
Condition: 
New
Category: 
Other
Disciplines: 
Electronic Engineering
Location
Department: 
Electrical, Electronic and Computer Engineering
Corner of University Road and Lynnwood Road University of Pretoria
Pretoria
0002

Contact Person/s

Name: Prof Saurabh Sinha
Phone: +27 12-420-2950
Email: ssinha@ieee.org

Grantholder

Title: Prof
First Name: Saurabh
Last Name: Sinha
Phone: +27 12-420-2950
Email: ssinha@ieee.org
Funding Information
Equipment Price: 
R2,400,000
Year of Acquisition: 
2012